中文
Fusion AM
The company provides metallization solutions for many fields such as communication devices, electronic components and photoelectric films.
Our goal is to continuously provide customized technologies and solutions through efficient and rapid research and development of the market and customers, and make continuous contributions to China's electronic industry.
Product Number
Function
Coating Process
Solid Content（%）
Viscosity（Pa.s）
Brookfield DV-II, 14# 10rpm
Viscosity（dPa.s）
Rion
VT-06, 1# 10rpm
Firing Temperature（℃）
Characteristics
CSP-CFD13C14
5G Filter
Dipping
80.0±2
45±10
830-870
1. Anti-collision design
2. High edge-coating thickness
3. Wide coating process window
4. Multi-firing
CSP-CFD13C16
85.0±2
CSP-CFD09L4
System
Spraying
76.5±2
10±5
1. Dense fired silver layer
2. Low insert loss
3. Anti-stacking
CSP-CFD09L5 System
20±5
4. Anti-bubbles issue
CSP-CFD09G3
CSP-CFD09L4-2
Mono Block
Dripping
15±5
1. Siler layer uniform
2. Good matching with ceramic
CSP-CFD09P80B
Printing
81.5±2
280±50
800-900
1. Good printing resolution
3. Good adhesion performance
NSP-S2175
1. Good spraying performance
NSP-2175L
25±10
NSP-S1375
Frontal electrode
80±40
800-840
1. Good printability
2. Bright sintered silver layer
3. High adhesion
NSP-S1365
66.5±2
70±30
3. Good resistance to vulcanization
NSP-S1360
Rear electrode
61.5±2
70±50
NSP-S1355
56.5±2
Solid Content
（%）
Firing Condition
Product Commonality
NSP-S3201
Bottom inner electrode
(C2)
48.5±2
170±50
850℃*10min
High adhesion
1. Lead-free cadmium and other harmful elements
2. Electroplatable, good acid resistance
3. Good soldering resistance (260℃*30sec)
4. Good compactness without porcelain leakage
5. Good weld drawing power
NSP-S3202
Flat, dense silver layer
NSP-S3203
Low shrink ration
NSP-S3102
Top inner
electrode
(C1)
74.5±2
300±100
Low resistivity
4. Low resistivity
NSP-S3103
Strong acid resistance
2. Dense surface
3. Good printability
Solid Content (%)
Viscosity (PA.S)
Firing temperature (℃)
NSP-S1201
External electrode paste
88.5±2
200±30
700-900
1. Meet the needs of fined printing
2. Good co-firing match
3. Dense sintered silver layer
4. Excellent electronical performance
NSP-S1202
300±30
NSP-S1203
89.5±2
450±50
NSP-S1221
Via paste
91.5±2
265±50
1. Full printing filling holes
4. Little shrinkage
NSP-S1222
300±50
NSP-S1211
Coating paste
Coating
75±20
700-800
1. Good process property
2. No porcelain body is exposed at acute angle
3. Good coating line
NSP-S1212
35±10
620-680
NSP-S3365
MLV/MLI
64.5±2
80±20
1. Good coating end apperance
2. Dense silver layer
3. No porcelain body is exposed at acute Angle
NSP-S3375
MLCC
720-780
4. Good electrical performance
NSP-S3401
Chip Fuse
67.5±2
70±20
580-620
Product Name
NSP-S7100
NSP-S5301
NSP-S5102
Membrane switch,FPC
Electrochromic
Appearance
Silver Gray
Viscosity
28,000±5000 mPa.s
370 dpa.s
70~100 pa.s
Curing condition
150℃x30min
100℃x30min
160℃x30min
Rsq/Rv
1 -2.5，10^(-5)Ω.cm
＜40mΩ
<5×10-7Ω·m
Chracteristics
Super low resistivity
Excellent laser etching performance
Long printing periods
Firing Condition（℃）
NSP-S4180
Varistor
Screen Printing
150±50
550-600
3. Good electrical performance
4. Meet ROHS environmental protection requirements
NSP-S4175
NSP-S4170
71.5±2
3. Meet ROHS environmental protection requirements