Paste solution for single & dual printing:

•Finger grid: excellent contact with wide firing window，enable ≤14μm opening ultra -fine line high-speed printing. 

•Busbar: enhanced adhesion with highly adaptable soldering window，promote rapid mass production of SMBB technology.

•Fusion pastes guarantee the perfect match to various device structure and process applications. With the CSP-M3Dx/M3Hx series in combination with the M3Mx busbar partner we offer proven high efficiency and reliability conductive paste solution for the changing photovoltaics industry.

• AgAl pastes for p+/p++ boron emitter & p poly contact: optimized Al amount with lower emitter damage for higher Voc, increased silver colloids in glass interface for better FF, new organic with improved fine-line capability to keep satisfied finger shape and paste consumption.

• Ag pastes for n poly contact: innovative frit chemistry design with extra thinner poly protection for excellent conductivity on differentiating surface contact and balanced Voc performance, solid content% & organic designed for reduced poly spiking and lower paste deposit.

• Busbar paste: Less fire through into the passivation stacks SiNx/SiONy and Al2O3/ SiNx, compatible with mainstream MBB module technology, Ultra lower Ag% with robust adhesion and soldering window.

• The next generation CSP-N3TF/N3TR series paste designed to maximize mass production efficiency of TOPCon solar cell. moreover, can be compatible with a variety of mainstream process technologies at present, including LPCVD poly, PECVD poly, boron SE/Non-SE, and so on.

• Low resistance paste for finger：Silver powder sintering technology are developed allowing low finger resistances of down to 4μΩ・cm and contact resistivities of down to 1 mOhm·cm².

• High peel strength paste for busbar: variable silver content solution applicable to 12 and more busbars, reliability proven fast curing package available, stable bulk and contact resistance under light and humidity environment.